ProductsManufacturers
Events
Send an RFQBOM Tool

MBM29DL322BD12PBT

Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. MBM29DL322BD12PBT
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Boot Block
    BOTTOM
  • Technology
    CMOS
  • Width (mm)
    7.95
  • Length (mm)
    13.95
  • JESD-30 Code
    R-PBGA-B57
  • Memory Width
    16
  • Package Code
    TFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    2MX16
  • Number of Functions
    1
  • Number of Terminals
    57
  • Terminal Pitch (mm)
    0.8
  • Access Time-Max (ns)
    120
  • Number of Words Code
    2M
  • Memory Density (bits)
    33554432
  • Package Body Material
    PLASTIC/EPOXY
  • Alternate Memory Width
    8
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3
  • Number of Words (words)
    2097152
  • Programming Voltage (V)
    3
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

0 suppliers available to buy or to bid for MBM29DL322BD12PBT

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MBM29DL322BD12PBT
Send an RFQ
MBM29DL322BD12PBT