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MB9AF111LAQN

SPANSION INC.

SPANSION INC. MB9AF111LAQN
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.25
  • SB Code
    8542.31.00.25
  • Bit Size
    32
  • Technology
    CMOS
  • Width (mm)
    9
  • Length (mm)
    9
  • Peripherals
    DMA(8), POR, PWM(8), TIMER(32), WDT(2)
  • Speed (MHz)
    40
  • ADC Channels
    YES
  • Connectivity
    CSIO(8), I2C(8), LIN(8), SPI, UART(8)
  • DAC Channels
    NO
  • DMA Channels
    YES
  • JESD-30 Code
    S-PQCC-N64
  • PWM Channels
    YES
  • Package Code
    HVQCCN
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • A/D Converters
    9-Ch 12-Bit
  • Address Bus Width
    0
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of I/O Lines
    51
  • Number of Terminals
    64
  • Program Memory Type
    FLASH
  • Terminal Pitch (mm)
    0.5
  • Data RAM Size (bytes)
    16384
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    0.9
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    4.5
  • External Data Bus Width
    0
  • Data EEPROM Size (bytes)
    0
  • Clock Frequency-Max (MHz)
    48
  • Program Memory Size (words)
    65536
  • Program Memory Width (bits)
    8
  • uPs/uCs/Peripheral ICs Type
    MICROCONTROLLER, RISC
  • Operating Temperature-Max (Cel)
    105
  • Operating Temperature-Min (Cel)
    -40

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MB9AF111LAQN