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MB90091AP

Fujitsu Semiconductor America, Inc.

MB90091AP Datasheet
Fujitsu Semiconductor America, Inc. MB90091AP
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    19.05
  • Length (mm)
    58
  • JESD-30 Code
    R-PDIP-T64
  • Package Code
    SDIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, SHRINK PITCH Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Address Bus Width
    16
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1.778
  • Display Configuration
    24 X 12 CHARACTERS
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    5.65
  • Supply Voltage-Max (V)
    5.25
  • Supply Voltage-Min (V)
    4.75
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • uPs/uCs/Peripheral ICs Type
    DISPLAY CONTROLLER, FLUORESCENT
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

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MB90091AP
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MB90091AP