ProductsManufacturers
Events
Send an RFQBOM Tool

MB89372APSH

Fujitsu Semiconductor America, Inc.

MB89372APSH Datasheet
Fujitsu Semiconductor America, Inc. MB89372APSH
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    CMOS
  • Width (mm)
    19.05
  • Length (mm)
    58
  • RAM (words)
    0
  • JESD-30 Code
    R-PDIP-T64
  • Package Code
    SDIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE, SHRINK PITCH Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Low Power Mode
    NO
  • Address Bus Width
    24
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of I/O Lines
    0
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1.778
  • Number of Serial I/Os
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Communication Standard
    ASYNC, BIT; SYNC, BYTE; BISYNC; EXT SYNC
  • Number of DMA Channels
    4
  • On Chip Data RAM Width
    0
  • Seated Height-Max (mm)
    5.65
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    8
  • Supply Current-Max (mA)
    40
  • Clock Frequency-Max (MHz)
    8
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER)
  • Data Transfer Rate-Max (MBps)
    0.25
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for MB89372APSH

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MB89372APSH
Send an RFQ
MB89372APSH