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MB87029P

Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. MB87029P
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    10.16
  • Length (mm)
    27.55
  • JESD-30 Code
    R-PDIP-T22
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Telecom IC Type
    TELEPHONE DIALER CIRCUIT
  • Make-break Ratio
    1:1.6
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Additional Feature
    SELECTABLE MAKE/BREAK RATIO 1:2
  • Number of Functions
    1
  • Number of Terminals
    22
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    5
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    5
  • Operating Temperature-Max (Cel)
    60
  • Operating Temperature-Min (Cel)
    -30

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MB87029P
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MB87029P