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MB86460APFQ

Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. MB86460APFQ
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    12
  • Length (mm)
    12
  • JESD-30 Code
    S-PQFP-G48
  • Package Code
    QFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Telecom IC Type
    MODEM
  • Data Rate (Mbps)
    0.0012
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    QUAD
  • Additional Feature
    FULL DUPLEX
  • Number of Functions
    1
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    0.8
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.7
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    8.5
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -20

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MB86460APFQ
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MB86460APFQ