ProductsManufacturers
Events
Send an RFQBOM Tool

MB85RS2MTAPNF-G-BDE1

Fujitsu Limited

Fujitsu Limited MB85RS2MTAPNF-G-BDE1
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Width
    3.9 mm
  • Length
    4.89 mm
  • Endurance
    10000000000000 Write/Erase Cycles
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Memory Width
    8
  • Organization
    256KX8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory Density
    2097152 bit
  • Memory IC Type
    FRAM
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1.27 mm
  • Number of Words
    262144 words
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Write Protection
    HARDWARE
  • Seated Height-Max
    1.73 mm
  • Terminal Position
    DUAL
  • Additional Feature
    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
  • Supply Current-Max
    2.3 mA
  • Number of Functions
    1
  • Number of Terminals
    8
  • Standby Current-Max
    5.0E-5 Amp
  • Standby Voltage-Min
    1.7 V
  • Number of Words Code
    256K
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    10
  • Package Equivalence Code
    SOP8,.25
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Clock Frequency-Max (fCLK)
    40 MHz
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED

0 suppliers available to buy or to bid for MB85RS2MTAPNF-G-BDE1

Send an RFQ

Your RFQ will be directly sent to our expert: Ayesha

Send an RFQ
MB85RS2MTAPNF-G-BDE1
Send an RFQ
MB85RS2MTAPNF-G-BDE1