ProductsManufacturers
Events
Send an RFQBOM Tool

MB81C1001-80LC

Fujitsu Limited

Fujitsu Limited MB81C1001-80LC
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.02
  • SB Code
    8542.32.00.15
  • I/O Type
    SEPARATE
  • Technology
    CMOS
  • JESD-30 Code
    R-XDIP-T18
  • Memory Width
    1
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Memory IC Type
    NIBBLE MODE DRAM
  • Refresh Cycles
    512
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Memory Organization
    1MX1
  • Number of Terminals
    18
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    80
  • Number of Words Code
    1M
  • Memory Density (bits)
    1048576
  • Package Body Material
    CERAMIC
  • Output Characteristics
    3-STATE
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    1048576
  • Standby Current-Max (A)
    0.00025
  • Supply Current-Max (mA)
    65
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    0

0 suppliers available to buy or to bid for MB81C1001-80LC

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
MB81C1001-80LC
Send an RFQ
MB81C1001-80LC