Fujitsu Limited MB768-CR
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-XPGA-P88
  • Package Code
    PGA
  • JESD-609 Code
    e0
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • Terminal Pitch
    2.54 mm
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Interface IC Type
    PECL TO CMOS/TTL TRANSLATOR
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    PERPENDICULAR
  • Number of Terminals
    88
  • Qualification Status
    Not Qualified
  • Package Body Material
    CERAMIC
  • Package Equivalence Code
    HPGA88M,12X12
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel

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