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MB7123EZ

Fujitsu Semiconductor America, Inc.

Fujitsu Semiconductor America, Inc. MB7123EZ
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    BIPOLAR
  • Width (mm)
    7.62
  • Length (mm)
    24.13
  • JESD-30 Code
    R-GDIP-T20
  • Memory Width
    8
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Memory IC Type
    OTP ROM
  • Operating Mode
    ASYNCHRONOUS
  • Parallel/Serial
    PARALLEL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    DUAL
  • Memory Organization
    32KX8
  • Number of Functions
    1
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    2.54
  • Access Time-Max (ns)
    45
  • Number of Words Code
    32K
  • Memory Density (bits)
    262144
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Nom (V)
    5
  • Number of Words (words)
    512
  • Supply Current-Max (mA)
    125
  • Operating Temperature-Max (Cel)
    75
  • Operating Temperature-Min (Cel)
    0

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MB7123EZ
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MB7123EZ