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MAXQ617V-L000+T

Analog Devices, Inc.

Analog Devices, Inc. MAXQ617V-L000+T
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.70
  • JESD-30 Code
    S-PBGA-B16
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Finish
    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    BGA16,4X4,16
  • Moisture Sensitivity Level
    1
  • uPs/uCs/Peripheral ICs Type
    SoC
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    70
  • Operating Temperature-Min (Cel)
    -20
  • Time@Peak Reflow Temperature-Max (s)
    30

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MAXQ617V-L000+T
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MAXQ617V-L000+T