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MAX3100ETG+T

Analog Devices, Inc.

Analog Devices, Inc. MAX3100ETG+T
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.30
  • Technology
    BICMOS
  • Width (mm)
    4
  • Length (mm)
    4
  • JESD-30 Code
    S-XQCC-N24
  • Package Code
    HVQCCN
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • J-STD-609 Code
    e3
  • Low Power Mode
    YES
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Address Bus Width
    0
  • Bus Compatibility
    IRDA; MICROWIRE; RS232; RS485; SPI
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    0.5
  • Number of Serial I/Os
    1
  • Package Body Material
    UNSPECIFIED
  • Communication Standard
    ASYNC, BIT
  • Seated Height-Max (mm)
    0.8
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.7
  • Supply Voltage-Nom (V)
    3.3
  • External Data Bus Width
    0
  • Clock Frequency-Max (MHz)
    4
  • Moisture Sensitivity Level
    1
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
  • Data Transfer Rate-Max (MBps)
    0.028125
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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MAX3100ETG+T
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MAX3100ETG+T