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MAX20355EWO+T

Analog Devices, Inc.

Analog Devices, Inc. MAX20355EWO+T
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Width (mm)
    2.798
  • Length (mm)
    3.048
  • JESD-30 Code
    R-XBGA-B42
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Terminal Finish
    Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
  • Interface IC Type
    INTERFACE CIRCUIT
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    42
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    0.69
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    2.8
  • Supply Voltage-Nom (V)
    2.9
  • Package Equivalence Code
    BGA42,6X7,16
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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MAX20355EWO+T
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MAX20355EWO+T