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MAX11059ECB+T

Analog Devices, Inc.

Analog Devices, Inc. MAX11059ECB+T
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.30
  • Technology
    BICMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-XQFP-G64
  • Package Code
    HTFQFP
  • Output Format
    PARALLEL, WORD
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Converter Type
    ADC, RESISTANCE LADDER
  • J-STD-609 Code
    e3
  • Number of Bits
    14
  • Output Bit Code
    OFFSET BINARY, 2S COMPLEMENT BINARY
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • DLA Qualification
    Not Qualified
  • Sample Rate (MHz)
    0.25
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    UNSPECIFIED
  • Seated Height-Max (mm)
    1.2
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    25
  • Conversion Time-Max (us)
    3
  • Package Equivalence Code
    TQFP64,.47SQ
  • Moisture Sensitivity Level
    3
  • Analog Input Voltage-Max (V)
    5.0166
  • Analog Input Voltage-Min (V)
    0
  • Linearity Error-Max (EL) (%)
    0.0055
  • Number of Analog In Channels
    4
  • Peak Reflow Temperature (Cel)
    260
  • Sample-and-Hold/Track-and-Hold
    TRACK
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    30

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MAX11059ECB+T
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MAX11059ECB+T