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MA808DG

GEC PLESSEY SEMICONDUCTORS

MA808DG Datasheet
GEC PLESSEY SEMICONDUCTORS MA808DG
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    33.02
  • Carrier Type
    CEPT PCM-30/E-1
  • JESD-30 Code
    R-GDIP-T24
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Telecom IC Type
    FRAMER
  • Terminal Finish
    TIN LEAD
  • Data Rate (Mbps)
    2.048
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    2.54
  • Package Body Material
    CERAMIC, GLASS-SEALED
  • Seated Height-Max (mm)
    5.08
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    DIP24,.6
  • Operating Temperature-Max (Cel)
    55
  • Operating Temperature-Min (Cel)
    -10

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MA808DG