MILL-MAX Mfg. Corp M83734/8-033
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8536.90.40.00
  • SB Code
    8536.90.40.00
  • JESD-609 Code
    e0
  • Contact Material
    NOT APPLICABLE
  • Housing Material
    GLASS FILLED POLYETHYLENE POLYESTER
  • Additional Feature
    STANDARD: MIL-S-83734, DIP SOCKET
  • Device Socket Type
    IC SOCKET
  • Number of Contacts
    24
  • Device Type Used On
    DIP24
  • Contact Finish - Mating
    NOT APPLICABLE
  • Contact Finish - Termination
    Tin/Lead (Sn/Pb)

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M83734/8-033
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M83734/8-033