ProductsManufacturers
Events
Send an RFQBOM Tool

M6MGB166S2BWG-90

Mitsubishi Electric Corp.

Mitsubishi Electric Corp. M6MGB166S2BWG-90
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.71
  • SB Code
    8542.32.00.70
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B72
  • Memory Width
    16
  • Organization
    1MX16
  • Package Code
    BGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    16777216 bit
  • Memory IC Type
    MEMORY CIRCUIT
  • Operating Mode
    ASYNCHRONOUS
  • Number of Words
    1048576 words
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Additional Feature
    COMBINATION OF 3.3V FLASH MEM & SRAM IN -CSP; ACCESS TIME FOR FLASH MEM IS 90NS & FOR SRAM 85 NS
  • Number of Functions
    1
  • Number of Terminals
    72
  • Number of Words Code
    1M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -20 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

0 suppliers available to buy or to bid for M6MGB166S2BWG-90

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
M6MGB166S2BWG-90
Send an RFQ
M6MGB166S2BWG-90