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M471B5173CB0-YH9

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. M471B5173CB0-YH9
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.36
  • SB Code
    8542.32.00.23
  • Width
    3.8 mm
  • Length
    67.6 mm
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    SINGLE BANK PAGE BURST
  • JESD-30 Code
    R-XDMA-N204
  • Memory Width
    64
  • Organization
    512MX64
  • Package Code
    DIMM
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    34359738368 bit
  • Memory IC Type
    DDR DRAM MODULE
  • Operating Mode
    SYNCHRONOUS
  • Refresh Cycles
    8192
  • Terminal Pitch
    0.6 mm
  • Access Time-Max
    0.255 ns
  • Number of Ports
    1
  • Number of Words
    536870912 words
  • Seated Height-Max
    30.13 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    DUAL
  • Additional Feature
    AUTO/SELF REFRESH; WD-MAX; ALSO OPERATES AT 1.5V NOMINAL SUPPLY
  • Supply Current-Max
    1040 mA
  • Number of Functions
    1
  • Number of Terminals
    204
  • Standby Current-Max
    0.088 Amp
  • Number of Words Code
    512M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM204,24
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    1.45 V
  • Supply Voltage-Min (Vsup)
    1.283 V
  • Supply Voltage-Nom (Vsup)
    1.35 V
  • Clock Frequency-Max (fCLK)
    667 MHz

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M471B5173CB0-YH9