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M466F0804DT1-L60

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. M466F0804DT1-L60
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • Access Mode
    FAST PAGE WITH EDO
  • JESD-30 Code
    R-XDMA-N144
  • Memory Width
    64
  • Organization
    8MX64
  • Package Code
    DIMM
  • Self Refresh
    YES
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    536870912 bit
  • Memory IC Type
    EDO DRAM MODULE
  • Operating Mode
    ASYNCHRONOUS
  • Refresh Cycles
    4096
  • Terminal Pitch
    0.8 mm
  • Access Time-Max
    60 ns
  • Number of Ports
    1
  • Number of Words
    8388608 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Additional Feature
    RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH
  • Supply Current-Max
    444 mA
  • Number of Functions
    1
  • Number of Terminals
    144
  • Standby Current-Max
    0.0016 Amp
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    UNSPECIFIED
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM144,32
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    3 V
  • Supply Voltage-Nom (Vsup)
    3.3 V

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M466F0804DT1-L60
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M466F0804DT1-L60