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M3DB-L

MOSDESIGN SEMICONDUCTOR CORP

MOSDESIGN SEMICONDUCTOR CORP M3DB-L
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PDIP-T18
  • Package Code
    DIP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • Telecom IC Type
    TELECOM CIRCUIT
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    18
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP18(UNSPEC)
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    -20 Cel

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M3DB-L
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M3DB-L