M391B5673GB0-CF8 by Samsung Semiconductor, Inc. | Sourcengine

Samsung Semiconductor, Inc. M391B5673GB0-CF8

Lifecycle status
Active-Unconfirmed
REACH
REACH compliant
Description
DDR3 DRAM Module, 256MX72, 0.3ns, CMOS
Category
Semiconductors Memory ICs DRAMs DDR3 DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Length
133.35 mm
I/O Type
COMMON
Technology
CMOS
Access Mode
DUAL BANK PAGE BURST
JESD-30 Code
R-XDMA-N240
Memory Width
72
Organization
256MX72
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory Density
19327352832 bit
Memory IC Type
DDR3 DRAM MODULE
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Terminal Pitch
1 mm
Access Time-Max
0.3 ns
Number of Ports
1
Number of Words
268435456 words
Seated Height-Max
30.15 mm
Temperature Grade
OTHER
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH
Supply Current-Max
1080 mA
Number of Functions
1
Number of Terminals
240
Standby Current-Max
0.18 Amp
Number of Words Code
256M
Qualification Status
Not Qualified
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Package Equivalence Code
DIMM240,40
Operating Temperature-Max
95 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
1.575 V
Supply Voltage-Min (Vsup)
1.425 V
Supply Voltage-Nom (Vsup)
1.5 V
Clock Frequency-Max (fCLK)
533 MHz