M391B1G73BH0-H9 by Samsung Semiconductor, Inc. | Sourcengine

Samsung Semiconductor, Inc. M391B1G73BH0-H9

Lifecycle status
Active-Unconfirmed
REACH
REACH compliant
Description
DDR3 DRAM Module, 1GX72, 20ns, CMOS, PDMA240
Category
Semiconductors Memory ICs DRAMs DDR3 DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR

I/O Type
COMMON
Technology
CMOS
Width (mm)
4
Access Mode
DUAL BANK PAGE BURST
Length (mm)
133.35
JESD-30 Code
R-PDMA-N240
Memory Width
72
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory IC Type
DDR3 DRAM MODULE
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Number of Ports
1
Terminal Position
DUAL
Memory Organization
1GX72
Number of Functions
1
Number of Terminals
240
Terminal Pitch (mm)
1
Access Time-Max (ns)
20
Number of Words Code
1G
Memory Density (bits)
77309411328
Package Body Material
PLASTIC/EPOXY
Output Characteristics
3-STATE
Seated Height-Max (mm)
30.15
Supply Voltage-Max (V)
1.575
Supply Voltage-Min (V)
1.425
Supply Voltage-Nom (V)
1.5
Number of Words (words)
1073741824
Sequential Burst Length
4,8
Standby Current-Max (A)
0.27
Supply Current-Max (mA)
1710
Interleaved Burst Length
4,8
Package Equivalence Code
DIMM240,40
Clock Frequency-Max (MHz)
667
Operating Temperature-Max (Cel)
95
Operating Temperature-Min (Cel)
0