M391B1G73AH0-YH9 by Samsung Semiconductor, Inc. | Sourcengine

Samsung Semiconductor, Inc. M391B1G73AH0-YH9

Lifecycle status
Discontinued
RoHS
RoHS compliant
Description
DDR DRAM Module, 1GX64, 0.255ns, CMOS
Category
Semiconductors Memory ICs DRAMs DDR DRAM MODULE

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.36
SB Code
8542.32.00.23

Width
4 mm
Length
133.35 mm
I/O Type
COMMON
Technology
CMOS
Access Mode
DUAL BANK PAGE BURST
JESD-30 Code
R-XDMA-N240
Memory Width
64
Organization
1GX64
Package Code
DIMM
Self Refresh
YES
Package Shape
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY Meter
Surface Mount
NO
Terminal Form
NO LEAD
Memory Density
68719476736 bit
Memory IC Type
DDR DRAM MODULE
Operating Mode
SYNCHRONOUS
Refresh Cycles
8192
Terminal Pitch
1 mm
Access Time-Max
0.255 ns
Number of Ports
1
Number of Words
1073741824 words
Seated Height-Max
30.15 mm
Temperature Grade
OTHER
Terminal Position
DUAL
Additional Feature
AUTO/SELF REFRESH; ALSO OPERATES AT 1.5V SUPPLY; WD-MAX
Number of Functions
1
Number of Terminals
240
Number of Words Code
1G
Qualification Status
Not Qualified
Package Body Material
UNSPECIFIED
Output Characteristics
3-STATE
Package Equivalence Code
DIMM240,40
Operating Temperature-Max
85 Cel
Operating Temperature-Min
0 Cel
Supply Voltage-Max (Vsup)
1.45 V
Supply Voltage-Min (Vsup)
1.283 V
Supply Voltage-Nom (Vsup)
1.35 V
Clock Frequency-Max (fCLK)
667 MHz
Peak Reflow Temperature (Cel)
260