M38510/20602BVX by Advanced Micro Devices, Inc. (AMD) | Sourcengine

Advanced Micro Devices, Inc. (AMD) M38510/20602BVX

Lifecycle status
Discontinued
Description
OTP ROM
Category
Semiconductors Memory ICs OTP ROMs OTP ROM

ECCN
EAR99
ECCN Governance
EAR
HTS Code
8542.32.00.71
SB Code
8542.32.00.70

I/O Type
COMMON
Technology
BIPOLAR
Width (mm)
10.16
Length (mm)
9.65
JESD-30 Code
R-CDIP-T18
Memory Width
4
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE Meter
Surface Mount
NO
Terminal Form
THROUGH-HOLE
Memory IC Type
OTP ROM
Operating Mode
ASYNCHRONOUS
Parallel/Serial
PARALLEL
DLA Qualification
Not Qualified
Terminal Position
DUAL
Memory Organization
1KX4
Number of Functions
1
Number of Terminals
18
Terminal Pitch (mm)
1.27
Access Time-Max (ns)
85
Number of Words Code
1K
Memory Density (bits)
4096
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Output Characteristics
3-STATE
Seated Height-Max (mm)
2.16
Supply Voltage-Max (V)
5.5
Supply Voltage-Min (V)
4.5
Supply Voltage-Nom (V)
5
Number of Words (words)
1024
Programming Voltage (V)
5
Supply Current-Max (mA)
140
Package Equivalence Code
DIP18,.3
Operating Temperature-Max (Cel)
125
Operating Temperature-Min (Cel)
-55
Screening Level / Reference Standard
MIL-M-38510 Class B