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M364E0803BF0-C600

Samsung Semiconductor, Inc.

Samsung Semiconductor, Inc. M364E0803BF0-C600
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.28
  • SB Code
    8542.32.00.15
  • I/O Type
    COMMON
  • Technology
    CMOS
  • JESD-30 Code
    R-PDMA-N168
  • Memory Width
    64
  • Organization
    8MX64
  • Package Code
    DIMM
  • Package Shape
    RECTANGULAR
  • Package Style
    MICROELECTRONIC ASSEMBLY Meter
  • Surface Mount
    NO
  • Terminal Form
    NO LEAD
  • Memory Density
    536870912 bit
  • Memory IC Type
    EDO DRAM MODULE
  • Refresh Cycles
    4096
  • Terminal Pitch
    1.27 mm
  • Access Time-Max
    60 ns
  • Number of Words
    8388608 words
  • Temperature Grade
    COMMERCIAL
  • Terminal Position
    DUAL
  • Supply Current-Max
    880 mA
  • Number of Terminals
    168
  • Standby Current-Max
    0.03 Amp
  • Number of Words Code
    8M
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Output Characteristics
    3-STATE
  • Package Equivalence Code
    DIMM168
  • Operating Temperature-Max
    70 Cel
  • Operating Temperature-Min
    0 Cel
  • Supply Voltage-Nom (Vsup)
    5 V

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M364E0803BF0-C600
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M364E0803BF0-C600