M2S025TS-1FCSG325

Microsemi Corporation

Microsemi Corporation M2S025TS-1FCSG325
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.31.00.60
  • Technology
    CMOS
  • Width (mm)
    11
  • Length (mm)
    11
  • JESD-30 Code
    S-PBGA-B325
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Number of Inputs
    180
  • DLA Qualification
    Not Qualified
  • Number of Outputs
    180
  • Terminal Position
    BOTTOM
  • Additional Feature
    LG-MIN, WD-MIN
  • Number of Terminals
    325
  • Terminal Pitch (mm)
    0.5
  • Number of Logic Cells
    27696
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.01
  • Supply Voltage-Max (V)
    1.26
  • Supply Voltage-Min (V)
    1.14
  • Supply Voltage-Nom (V)
    1.2
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Package Equivalence Code
    BGA325,21X21,20
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    250
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    0
  • Time@Peak Reflow Temperature-Max (s)
    40

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