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M25PX64SVZM3EB

Micron Technology

Micron Technology M25PX64SVZM3EB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Width
    6 mm
  • Length
    8 mm
  • Technology
    CMOS
  • JESD-30 Code
    R-PBGA-B24
  • Memory Width
    8
  • Organization
    8MX8
  • Package Code
    TBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, THIN PROFILE Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory Density
    67108864 bit
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Terminal Pitch
    1 mm
  • Number of Words
    8388608 words
  • Parallel/Serial
    SERIAL
  • Seated Height-Max
    1.2 mm
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    24
  • Programming Voltage
    2.7 V
  • Number of Words Code
    8M
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Max (Vsup)
    3.6 V
  • Supply Voltage-Min (Vsup)
    2.7 V
  • Supply Voltage-Nom (Vsup)
    3 V
  • Clock Frequency-Max (fCLK)
    75 MHz

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M25PX64SVZM3EB