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M25PX16SVZM6TP

Micron Technology

Micron Technology M25PX16SVZM6TP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B24
  • Memory Width
    8
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Memory IC Type
    FLASH
  • Operating Mode
    SYNCHRONOUS
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Memory Organization
    2MX8
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    1
  • Number of Words Code
    2M
  • Memory Density (bits)
    16777216
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Max (V)
    3.6
  • Supply Voltage-Min (V)
    2.3
  • Data Retention Time-Min
    20
  • Number of Words (words)
    2097152
  • Standby Current-Max (A)
    1.0E-5
  • Supply Current-Max (mA)
    15
  • Package Equivalence Code
    BGA24,5X5,40
  • Clock Frequency-Max (MHz)
    75
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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M25PX16SVZM6TP