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M25P64-VMF3TGBA

Micron Technology

Micron Technology M25P64-VMF3TGBA
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.32.00.51
  • SB Code
    8542.32.00.50
  • Type
    NOR TYPE
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G16
  • Memory Width
    8
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Memory IC Type
    FLASH
  • Parallel/Serial
    SERIAL
  • Serial Bus Type
    SPI
  • Write Protection
    HARDWARE/SOFTWARE
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Memory Organization
    8MX8
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    1.27
  • Number of Words Code
    8M
  • Memory Density (bits)
    67108864
  • Package Body Material
    PLASTIC/EPOXY
  • Data Retention Time-Min
    20
  • Number of Words (words)
    8388608
  • Standby Current-Max (A)
    0.0001
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    SOP16,.4
  • Clock Frequency-Max (MHz)
    50
  • Endurance (Write/Erase Cycles)
    100000
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40

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M25P64-VMF3TGBA
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M25P64-VMF3TGBA