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LXP730LE

Intel Corporation

Intel Corporation LXP730LE
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    10
  • Length (mm)
    10
  • JESD-30 Code
    S-PQFP-G64
  • Package Code
    LFQFP
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK, LOW PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Telecom IC Type
    FRAMER
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    QUAD
  • Number of Functions
    1
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.6
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    QFP64,.47SQ,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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LXP730LE
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LXP730LE