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LXP2175SE

Intel Corporation

LXP2175SE Datasheet
Intel Corporation LXP2175SE
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    7.5
  • Length (mm)
    10.3
  • Carrier Type
    CEPT PCM-30/E-1
  • JESD-30 Code
    R-PDSO-G16
  • Package Code
    SOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Telecom IC Type
    ELASTIC BUFFER
  • Terminal Finish
    TIN LEAD
  • Data Rate (Mbps)
    2.048
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    16
  • Terminal Pitch (mm)
    1.27
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    2.65
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    SOP16,.4
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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LXP2175SE
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LXP2175SE