ProductsManufacturers
Events
Send an RFQBOM Tool

LU82551ER

Intel Corporation

Intel Corporation LU82551ER
  • ECCN
    5A991
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Width
    15 mm
  • Length
    15 mm
  • Technology
    CMOS
  • JESD-30 Code
    S-PBGA-B196
  • Package Code
    BGA
  • Boundary Scan
    NO
  • JESD-609 Code
    e1
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Low Power Mode
    YES
  • Terminal Pitch
    1 mm
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Address Bus Width
    32
  • Seated Height-Max
    1.75 mm
  • Temperature Grade
    OTHER
  • Terminal Position
    BOTTOM
  • Supply Current-Max
    155 mA
  • Supply Voltage-Max
    3.6 V
  • Supply Voltage-Min
    3 V
  • Supply Voltage-Nom
    3.3 V
  • Clock Frequency-Max
    25 MHz
  • Number of Terminals
    196
  • Qualification Status
    Not Qualified
  • Number of Serial I/Os
    1
  • Package Body Material
    PLASTIC/EPOXY
  • Data Transfer Rate-Max
    12.5 MBps
  • External Data Bus Width
    32
  • Package Equivalence Code
    BGA196,14X14,40
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    0 Cel
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    SERIAL IO/COMMUNICATION CONTROLLER, LAN
  • Data Encoding/Decoding Method
    NRZ; NRZI; BIPH-LEVEL(MANCHESTER)
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    30

0 suppliers available to buy or to bid for LU82551ER

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
LU82551ER
Send an RFQ
LU82551ER