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LSP1000-250

Microsemi Corporation

Microsemi Corporation LSP1000-250
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8541.10.00.80
  • SB Code
    8541.10.00.80
  • Diode Type
    PIN DIODE
  • Technology
    POSITIVE-INTRINSIC-NEGATIVE
  • Application
    SWITCHING
  • JESD-30 Code
    R-XBCC-N2
  • Configuration
    SINGLE
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    CHIP CARRIER Meter
  • Surface Mount
    YES
  • Terminal Form
    NO LEAD
  • Frequency Band
    C BAND
  • Terminal Finish
    TIN LEAD
  • Terminal Position
    BOTTOM
  • Number of Elements
    1
  • Number of Terminals
    2
  • Qualification Status
    Not Qualified
  • Breakdown Voltage-Min
    35 V
  • Diode Capacitance-Max
    0.28 pF
  • Package Body Material
    UNSPECIFIED
  • Power Dissipation-Max
    0.5 W
  • Diode Element Material
    SILICON
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -65 Cel
  • Diode Forward Resistance-Max
    2.5 ohm
  • Minority Carrier Lifetime-Nom
    0.08 us

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LSP1000-250
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LSP1000-250