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LP3929TMEX-AACQ

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LP3929TMEX-AACQ
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    2.015
  • Length (mm)
    2.015
  • JESD-30 Code
    S-XBGA-B24
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    COMMERCIAL EXTENDED
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    24
  • Terminal Pitch (mm)
    0.4
  • Package Body Material
    UNSPECIFIED
  • Analog IC - Other Type
    ANALOG CIRCUIT
  • Seated Height-Max (mm)
    0.675
  • Supply Voltage-Max (V)
    1.92
  • Supply Voltage-Min (V)
    1.71
  • Supply Voltage-Nom (V)
    1.8
  • Package Equivalence Code
    BGA24,5X5,16
  • Moisture Sensitivity Level
    1
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -30
  • Time@Peak Reflow Temperature-Max (s)
    40

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LP3929TMEX-AACQ
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LP3929TMEX-AACQ