ProductsManufacturers
Events
Send an RFQBOM Tool

LMV762QMMX/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMV762QMMX/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    COMPARATOR
  • J-STD-609 Code
    e3
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Number of Functions
    2
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Response Time-Nom (ns)
    270
  • Supply Current-Max (mA)
    1.4
  • Package Equivalence Code
    TSSOP8,.19
  • Moisture Sensitivity Level
    1
  • Input Offset Voltage-Max (uV)
    1000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    5.0E-5
  • Screening Level / Reference Standard
    AEC-Q100
  • Time@Peak Reflow Temperature-Max (s)
    40

0 suppliers available to buy or to bid for LMV762QMMX/NOPB

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
LMV762QMMX/NOPB
Send an RFQ
LMV762QMMX/NOPB