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LMV7272TL/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMV7272TL/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    BICMOS
  • Width (mm)
    1.514
  • Length (mm)
    1.514
  • JESD-30 Code
    S-PBGA-B8
  • Package Code
    VFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Amplifier Type
    COMPARATOR
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Response Time-Nom (ns)
    1100
  • Seated Height-Max (mm)
    0.6
  • Supply Voltage-Nom (V)
    1.8
  • Supply Current-Max (mA)
    0.03
  • Package Equivalence Code
    BGA8,3X3,20
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    5.5
  • Input Offset Voltage-Max (uV)
    4000
  • Peak Reflow Temperature (Cel)
    260
  • Negative Supply Voltage-Nom (V)
    0
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Neg Supply Voltage Limit-Max (V)
    0
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMV7272TL/NOPB
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LMV7272TL/NOPB