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LMV118MFX

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMV118MFX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    NO
  • Wideband
    NO
  • Low-Offset
    NO
  • Micropower
    YES
  • Technology
    BIPOLAR
  • Width (mm)
    1.6
  • Length (mm)
    2.92
  • JESD-30 Code
    R-PDSO-G6
  • Package Code
    LSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • J-STD-609 Code
    e0
  • Packing Method
    TAPE AND REEL
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • Voltage Gain-Min
    3160
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Programmable Power
    NO
  • Number of Functions
    1
  • Number of Terminals
    6
  • Terminal Pitch (mm)
    0.95
  • Slew Rate-Nom (V/us)
    35
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Seated Height-Max (mm)
    1.22
  • Supply Voltage-Nom (V)
    5
  • Supply Current-Max (mA)
    0.05
  • Package Equivalence Code
    TSOP6,.11,37
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    6.3
  • Input Offset Voltage-Max (uV)
    5000
  • Peak Reflow Temperature (Cel)
    260
  • Negative Supply Voltage-Nom (V)
    -5
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Neg Supply Voltage Limit-Max (V)
    -6.3
  • Common-mode Reject Ratio-Nom (dB)
    104
  • Average Bias Current-Max (IIB) (uA)
    -2
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMV118MFX
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LMV118MFX