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LMV115MGX/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMV115MGX/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width
    1.25 mm
  • Length
    2 mm
  • JESD-30 Code
    R-PDSO-G6
  • Package Code
    TSSOP
  • JESD-609 Code
    e3
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Slew Rate-Nom
    18 V/us
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    BUFFER
  • Terminal Pitch
    0.65 mm
  • Terminal Finish
    Matte Tin (Sn)
  • Seated Height-Max
    1.1 mm
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Output Current-Min
    0.1 A
  • Supply Current-Max
    0.52 mA
  • Bandwidth (3dB)-Nom
    9 MHz
  • Number of Functions
    1
  • Number of Terminals
    6
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP6,.08
  • Supply Voltage Limit-Max
    3.6 V
  • Operating Temperature-Max
    85 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    2.8 V
  • Moisture Sensitivity Level
    1
  • Neg Supply Voltage Limit-Max
    0 V
  • Neg Supply Voltage-Nom (Vsup)
    0 V
  • Peak Reflow Temperature (Cel)
    260
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMV115MGX/NOPB
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LMV115MGX/NOPB