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LMU217FMB30

LOGIC DEVICES INC

LOGIC DEVICES INC LMU217FMB30
  • ECCN
    3A991.a.2
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    22.86
  • Length (mm)
    22.86
  • JESD-30 Code
    S-CQFP-G64
  • Package Code
    QFP
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    FLATPACK Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    QUAD
  • Number of Terminals
    64
  • Terminal Pitch (mm)
    1.27
  • Output Data Bus Width
    32
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    2.286
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    16
  • Supply Current-Max (mA)
    25
  • Package Equivalence Code
    QFL64,.9SQ
  • Clock Frequency-Max (MHz)
    33.33
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, MULTIPLIER
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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LMU217FMB30
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LMU217FMB30