ProductsManufacturers
Events
Send an RFQBOM Tool

LMU17GM

LOGIC DEVICES INC

LOGIC DEVICES INC LMU17GM
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • JESD-30 Code
    S-CPGA-P68
  • Package Code
    PGA
  • Boundary Scan
    NO
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY Meter
  • Surface Mount
    NO
  • Terminal Form
    PIN/PEG
  • J-STD-609 Code
    e0
  • Low Power Mode
    YES
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    PERPENDICULAR
  • Number of Terminals
    68
  • Terminal Pitch (mm)
    2.54
  • Output Data Bus Width
    16
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    16
  • Package Equivalence Code
    PGA68,11X11
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, MULTIPLIER
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55

0 suppliers available to buy or to bid for LMU17GM

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
LMU17GM
Send an RFQ
LMU17GM