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LMU112DMB55

LOGIC DEVICES INC

LOGIC DEVICES INC LMU112DMB55
  • ECCN
    3A001.a.2.c
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.60
  • SB Code
    8542.39.00.60
  • Technology
    CMOS
  • Width (mm)
    15.24
  • Length (mm)
    60.96
  • JESD-30 Code
    R-CDIP-T48
  • Package Code
    DIP
  • Boundary Scan
    NO
  • Package Shape
    RECTANGULAR
  • Package Style
    IN-LINE Meter
  • Surface Mount
    NO
  • Terminal Form
    THROUGH-HOLE
  • J-STD-609 Code
    e0
  • Low Power Mode
    NO
  • Terminal Finish
    TIN LEAD
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    MILITARY
  • Terminal Position
    DUAL
  • Additional Feature
    2 X 12 BIT DATA INPUT BUS; 16 MOST SIGNIFICANT BITS OF RESULT; ICC SPECIFIED @ 5MHZ
  • Number of Terminals
    48
  • Terminal Pitch (mm)
    2.54
  • Output Data Bus Width
    16
  • Package Body Material
    CERAMIC, METAL-SEALED COFIRED
  • Seated Height-Max (mm)
    4.953
  • Supply Voltage-Max (V)
    5.5
  • Supply Voltage-Min (V)
    4.5
  • Supply Voltage-Nom (V)
    5
  • External Data Bus Width
    12
  • Supply Current-Max (mA)
    20
  • Package Equivalence Code
    DIP48,.6
  • Clock Frequency-Max (MHz)
    18.18
  • Moisture Sensitivity Level
    3
  • uPs/uCs/Peripheral ICs Type
    DSP PERIPHERAL, MULTIPLIER
  • Peak Reflow Temperature (Cel)
    225
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -55
  • Screening Level / Reference Standard
    38535Q/M;38534H;883B

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LMU112DMB55
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LMU112DMB55