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LMP8270MAX

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMP8270MAX
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Width
    3.899 mm
  • Length
    4.902 mm
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    SOP
  • JESD-609 Code
    e0
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE Meter
  • Slew Rate-Nom
    0.7 V/us
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Terminal Pitch
    1.27 mm
  • Terminal Finish
    Tin/Lead (Sn85Pb15)
  • Seated Height-Max
    1.753 mm
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Unity Gain BW-Nom
    80 kHz
  • Supply Current-Max
    1.4 mA
  • Number of Functions
    1
  • Number of Terminals
    8
  • Qualification Status
    Not Qualified
  • Package Body Material
    PLASTIC/EPOXY
  • Input Offset Voltage-Max
    1000 uV
  • Package Equivalence Code
    SOP8,.25
  • Supply Voltage Limit-Max
    5.75 V
  • Operating Temperature-Max
    125 Cel
  • Operating Temperature-Min
    -40 Cel
  • Supply Voltage-Nom (Vsup)
    5 V
  • Moisture Sensitivity Level
    1
  • Common-mode Reject Ratio-Nom
    78 dB
  • Peak Reflow Temperature (Cel)
    235
  • Average Bias Current-Max (IIB)
    0.02 uA
  • Time@Peak Reflow Temperature-Max (s)
    30

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LMP8270MAX
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LMP8270MAX