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LMP7300MM/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMP7300MM/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G8
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    COMPARATOR
  • J-STD-609 Code
    e3
  • Terminal Finish
    MATTE TIN
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Current-Max (mA)
    0.02
  • Package Equivalence Code
    TSSOP8,.19
  • Moisture Sensitivity Level
    1
  • Input Offset Voltage-Max (uV)
    2000
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    0.004
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMP7300MM/NOPB
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LMP7300MM/NOPB