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LMH6629MFE

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMH6629MFE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Power
    NO
  • Low-Bias
    NO
  • Wideband
    YES
  • Low-Offset
    YES
  • Micropower
    NO
  • Technology
    BIPOLAR
  • Width (mm)
    1.6
  • Length (mm)
    2.92
  • JESD-30 Code
    R-PDSO-G5
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • Packing Method
    TAPE AND REEL
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    AUTOMOTIVE
  • Terminal Position
    DUAL
  • Programmable Power
    NO
  • Number of Functions
    1
  • Number of Terminals
    5
  • Terminal Pitch (mm)
    0.953
  • Slew Rate-Nom (V/us)
    1500
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES (AVCL>=10)
  • Seated Height-Max (mm)
    1.19
  • Supply Voltage-Nom (V)
    3.3
  • Supply Current-Max (mA)
    18.2
  • Package Equivalence Code
    TSOP5/6,.11,37
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    6
  • Input Offset Voltage-Max (uV)
    700
  • Operating Temperature-Max (Cel)
    125
  • Operating Temperature-Min (Cel)
    -40
  • Bias Current-Max (IIB) @25C (uA)
    23
  • Common-mode Reject Ratio-Nom (dB)
    87
  • Average Bias Current-Max (IIB) (uA)
    -35

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LMH6629MFE
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LMH6629MFE