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LMH0346MHX

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMH0346MHX
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    R-PDSO-G20
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    GULL WING
  • J-STD-609 Code
    e0
  • Terminal Finish
    TIN LEAD
  • Consumer IC Type
    CONSUMER CIRCUIT
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    DUAL
  • Number of Terminals
    20
  • Terminal Pitch (mm)
    0.635
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP20,.25
  • Moisture Sensitivity Level
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMH0346MHX
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LMH0346MHX