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LMH0307GRE

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMH0307GRE
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • JESD-30 Code
    S-PBGA-B25
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Interface IC Type
    LINE DRIVER
  • Out Swing-Min (V)
    0.72
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Differential Output
    NO
  • Number of Terminals
    25
  • Terminal Pitch (mm)
    0.5
  • Driver Number of Bits
    2
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    3.3
  • Package Equivalence Code
    BGA25,5X5,20
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40

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LMH0307GRE
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LMH0307GRE