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LMC6035ITLX/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMC6035ITLX/NOPB
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.33.00.01
  • SB Code
    8542.33.00.00
  • Low-Bias
    YES
  • Low-Offset
    NO
  • Micropower
    YES
  • Technology
    CMOS
  • Width (mm)
    1.717
  • Length (mm)
    1.869
  • JESD-30 Code
    R-PBGA-B8
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • Amplifier Type
    OPERATIONAL AMPLIFIER
  • J-STD-609 Code
    e1
  • Packing Method
    TAPE AND REEL
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • Amp Architecture
    VOLTAGE-FEEDBACK
  • Voltage Gain-Min
    20000
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    2
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.5
  • Slew Rate-Nom (V/us)
    1.5
  • Package Body Material
    PLASTIC/EPOXY
  • Frequency Compensation
    YES
  • Supply Voltage-Nom (V)
    2.7
  • Supply Current-Max (mA)
    1.9
  • Unity Gain BW-Nom (kHz)
    1400
  • Package Equivalence Code
    BGA8,3X3,20
  • Moisture Sensitivity Level
    1
  • Supply Voltage Limit-Max (V)
    16
  • Input Offset Voltage-Max (uV)
    5000
  • Peak Reflow Temperature (Cel)
    260
  • Negative Supply Voltage-Nom (V)
    0
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Common-mode Reject Ratio-Nom (dB)
    96
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMC6035ITLX/NOPB
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LMC6035ITLX/NOPB