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LMC555CTP

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LMC555CTP
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.39.00.01
  • SB Code
    8542.39.00.00
  • Technology
    CMOS
  • Width (mm)
    1.387
  • Length (mm)
    1.412
  • JESD-30 Code
    R-PBGA-B8
  • Package Code
    FBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Functions
    1
  • Number of Terminals
    8
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Analog IC - Other Type
    PULSE; RECTANGULAR
  • Supply Voltage-Max (V)
    12
  • Supply Voltage-Min (V)
    1.5
  • Supply Voltage-Nom (V)
    5
  • Package Equivalence Code
    BGA8,3X3,20
  • Moisture Sensitivity Level
    1
  • Output Frequency-Max (MHz)
    3
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

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LMC555CTP