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LM8323JGR8AXM/NOPB

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LM8323JGR8AXM/NOPB
  • HTS Code
    8542.31.00.30
  • SB Code
    8542.31.00.30
  • JESD-30 Code
    S-PBGA-B36
  • Package Code
    FBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom (V)
    1.8
  • Supply Current-Max (mA)
    3
  • Package Equivalence Code
    BGA36,6X6,20
  • Moisture Sensitivity Level
    1
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

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LM8323JGR8AXM/NOPB
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LM8323JGR8AXM/NOPB