ProductsManufacturers
Events
Send an RFQBOM Tool

LM8322JGR8X

NATIONAL SEMICONDUCTOR CORP

NATIONAL SEMICONDUCTOR CORP LM8322JGR8X
  • ECCN
    EAR99
  • ECCN Governance
    EAR
  • HTS Code
    8542.31.00.01
  • SB Code
    8542.31.00.00
  • Technology
    CMOS
  • Width (mm)
    3.5
  • Length (mm)
    3.5
  • JESD-30 Code
    S-PBGA-B36
  • Package Code
    TFBGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, THIN PROFILE, FINE PITCH Meter
  • Surface Mount
    YES
  • Terminal Form
    BALL
  • J-STD-609 Code
    e1
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • DLA Qualification
    Not Qualified
  • Temperature Grade
    INDUSTRIAL
  • Terminal Position
    BOTTOM
  • Number of Terminals
    36
  • Terminal Pitch (mm)
    0.5
  • Package Body Material
    PLASTIC/EPOXY
  • Seated Height-Max (mm)
    1.1
  • Supply Voltage-Max (V)
    1.98
  • Supply Voltage-Min (V)
    1.62
  • Supply Voltage-Nom (V)
    1.8
  • Moisture Sensitivity Level
    1
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR CIRCUIT
  • Peak Reflow Temperature (Cel)
    260
  • Operating Temperature-Max (Cel)
    85
  • Operating Temperature-Min (Cel)
    -40
  • Time@Peak Reflow Temperature-Max (s)
    40

0 suppliers available to buy or to bid for LM8322JGR8X

Send an RFQ

Your RFQ will be directly sent to our expert: Pari

Send an RFQ
LM8322JGR8X
Send an RFQ
LM8322JGR8X